In this paper, a new sensor technology solution is proposed based on the co-design of tunable quantum-spin crossover material with smart photonics and RF Front-EndModule (FEM) integrating innovative Thermal-Body harvesting. The quantum-spin crossover material, co-integrated with the Photonics and RF Front-End-Module, hosts smart Low-Power Signal-Processor (LPSP) embedding ArtificialIntelligence (AI) and Machine-Learning (ML) algorithms for accurate sensing of vital-signs information. The smart signalprocessing capabilities are brought near the sensor to allow for real-time Correlation-based data analytics and decision-making process with secure wireless data transfer. The performances of the proposed technology solution are demonstrated by building a smart wearable Bracelet device for real-time sensing of Correlated body temperature and oxygen saturation levels. Porting of the Photonics and RF FEM into 22nm Fully Depleted Silicon On Insulator (FD-SOI) platform using Application Specific Integrated Circuit-based System on a Chip (ASIC-SoC) technology solution will foster a broad range of applications in mobile communications with smart devices and systems. Keywords—Tunable quantum-spin crossover material, Smart Photonics and RF Front-End-Modules, FD-SOI, Adaptive Body Biasing, 4-Terminal, Artificial Intelligence, Machine-Learning, Multiphysics-Correlation Analysis, Secure-Element.